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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
08/08/2023
Application #:
17043692
Filing Dt:
09/30/2020
Publication #:
Pub Dt:
03/04/2021
Inventors:
JUNHO SONG, EDWARD CHAN, STEVEN MICHAEL TAVOLETTI, MEHDI HEJAZI DEHAGHANI
Title:
THERMALLY-CONDUCTIVE MATERIAL LAYER AND INTERNAL STRUCTURE FOR ULTRASOUND IMAGING
Assignment: 1
Reel/Frame:
056542/0674Recorded: 06/15/2021Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
05/03/2019
Exec Dt:
05/03/2019
Exec Dt:
05/03/2019
Exec Dt:
06/15/2021
Assignee:
HIGH TECH CAMPUS 52
EINDHOVEN, NETHERLANDS 5656 AG
Correspondent:
PHILIPS INTELLECTUAL PROPERTY & STANDARDS
465 COLUMBUS AVENUE
SUITE 340
VALHALLA, NY 10595

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