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Patent Assignment Abstract of Title
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Total Assignments: 3
Patent #:
11721660
Issue Dt:
08/08/2023
Application #:
17924649
Filing Dt:
11/10/2022
Publication #:
20230215834
Pub Dt:
07/06/2023
Inventors:
Daizo ODA, Motoki ETO, Takashi YAMADA, Teruo HAIBARA, Ryo OISHI
Title:
BONDING WIRE FOR SEMICONDUCTOR DEVICES
Assignment: 1
Reel/Frame:
062119/0621Recorded: 12/16/2022Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
ODA, DAIZO
Exec Dt:
10/25/2022
ETO, MOTOKI
Exec Dt:
10/27/2022
HAIBARA, TERUO
Exec Dt:
10/25/2022
OISHI, RYO
Exec Dt:
10/25/2022
Assignee:
NIPPON MICROMETAL CORPORATION
158-1 OAZA SAYAMAGAHARA, IRUMA-SHI
SAITAMA, JAPAN 358-0032
Correspondent:
MCDERMOTT WILL & EMERY LLP
500 NORTH CAPITOL STREET, NW
WASHINGTON, DC 20001
Assignment: 2
Reel/Frame:
062512/0343Recorded: 01/25/2023Pages: 7
Conveyance:
CORRECTIVE ASSIGNMENT TO CORRECT THE OMISSION 3RD INVENTOR'S NAME PREVIOUSLY RECORDED AT REEL: 062119 FRAME: 0621. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT .
Assignors:
ODA, DAIZO
Exec Dt:
10/25/2022
ETO, MOTOKI
Exec Dt:
10/27/2022
YAMADA, TAKASHI
Exec Dt:
10/29/2022
HAIBARA, TERUO
Exec Dt:
10/25/2022
OISHI, RYO
Exec Dt:
10/25/2022
Assignee:
NIPPON MICROMETAL CORPORATION
158-1 OAZA SAYAMAGAHARA, IRUMA-SHI
SAITAMA, JAPAN 358-0032
Correspondent:
MCDERMOTT WILL & EMERY LLP
500 NORTH CAPITOL STREET, NW
WASHINGTON, DC 20001
Assignment: 3
Reel/Frame:
062699/0140Recorded: 02/09/2023Pages: 7
Conveyance:
CORRECTIVE ASSIGNMENT TO CORRECT THE EXECUTION DATES OF 2ND AND 3RD INVENTORS PREVIOUSLY RECORDED AT REEL: 065212 FRAME: 0343. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
Assignors:
ODA, DAIZO
Exec Dt:
10/25/2022
ETO, MOTOKI
Exec Dt:
10/25/2022
YAMADA, TAKASHI
Exec Dt:
10/27/2022
HAIBARA, TERUO
Exec Dt:
10/25/2022
OISHI, RYO
Exec Dt:
10/25/2022
Assignee:
NIPPON MICROMETAL CORPORATION
158-1 OAZA SAYAMAGAHARA, IRUMA-SHI
SAITAMA, JAPAN 358-0032
Correspondent:
MCDERMOTT WILL & EMERY LLP
500 NORTH CAPITOL STREET, NW
WASHINGTON, DC 20001

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