Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/15/2023
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Application #:
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17022090
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Filing Dt:
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09/16/2020
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Publication #:
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Pub Dt:
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01/07/2021
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Inventors:
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Yurika MUNEKAWA, Masaya ARAI, Tsukasa KATSUYAMA, Takeshi NAKANO, Takanori SHIMAZAKI
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Title:
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LEAD-FREE SOLDER ALLOY, SOLDER JOINING MATERIAL, ELECTRONIC CIRCUIT MOUNTING SUBSTRATE, AND ELECTRONIC CONTROL DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-19-43, HIGASHI-OIZUMI, NERIMA-KU |
| TOKYO, JAPAN 178-8511 |
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| MORI & WARD, LLP |
| 2000 DUKE STREET |
| SUITE 300 |
| ALEXANDRIA, VA 22314 |
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