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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
08/15/2023
Application #:
17352961
Filing Dt:
06/21/2021
Publication #:
Pub Dt:
10/07/2021
Inventors:
Mingzhu WANG, Bojie ZHAO, Takehiko TANAKA, Zhenyu CHEN, Heng JIANG, Nan GUO
Title:
SEMICONDUCTOR PACKAGING METHOD AND SEMICONDUCTOR DEVICE BASED ON MOLDING PROCESS
Assignment: 1
Reel/Frame:
056605/0673Recorded: 06/21/2021Pages: 9
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
04/16/2018
Exec Dt:
04/16/2018
Exec Dt:
04/17/2018
Exec Dt:
04/10/2018
Exec Dt:
04/10/2018
Exec Dt:
04/11/2018
Assignee:
66-68 SHUNYU ROAD, YUYAO CITY
NINGBO, ZHEJIANG, CHINA 315400
Correspondent:
HARVEST IP LAW LLP
1455 PENNSYLVANIA AVENUE NW, SUITE 400
WASHINGTON, 20004 UNITED STATES
Assignment: 2
Reel/Frame:
064120/0717Recorded: 06/15/2023Pages: 11
Conveyance:
CORRECTIVE ASSIGNMENT TO CORRECT THE THE ASSIGNEE NAME PREVIOUSLY RECORDED AT REEL: 056605 FRAME: 0673. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
Assignors:
Exec Dt:
04/16/2018
Exec Dt:
04/16/2018
Exec Dt:
04/17/2018
Exec Dt:
04/10/2018
Exec Dt:
04/10/2018
Exec Dt:
04/11/2018
Assignee:
66-68 SHUNYU ROAD, YUYAO CITY
NINGBO, ZHEJIANG, CHINA 315400
Correspondent:
HARVEST IP LAW LLP
1455 PENNSYLVANIA AVENUE NW, SUITE 400
WASHINGTON, DC 20004

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