Patent Assignment Abstract of Title
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Total Assignments:
4
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Patent #:
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Issue Dt:
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08/22/2023
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Application #:
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16022345
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Filing Dt:
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06/28/2018
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Publication #:
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Pub Dt:
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05/09/2019
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Inventors:
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Lik Wai Kho, Md Hasnine
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Title:
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HIGH RELIABILITY LEAD-FREE SOLDER ALLOY FOR ELECTRONIC APPLICATIONS IN EXTREME ENVIRONMENTS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 155 HARLEM AVENUE |
| GLENVIEW, ILLINOIS 60025 |
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| MCANDREWS, HELD & MALLOY, LTD. |
| 500 W. MADISON ST. |
| 34TH FLOOR |
| CHICAGO, IL 60661 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 155 HARLEM AVENUE |
| GLENVIEW, ILLINOIS 60025 |
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| MCANDREWS, HELD & MALLOY, LTD. |
| 500 W. MADISON ST. |
| 34TH FLOOR |
| CHICAGO, IL 60661 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 800 W. THORNDALE AVE |
| ITASCA, ILLINOIS 60143 |
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| ARLENE ALEGRE |
| 155 HARLEM AVE |
| IP LEGAL DEPT |
| GLENVIEW, IL 60025 |
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Assignment:
4
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 245 FREIGHT STREET |
| WATERBURY, CONNECTICUT 06702 |
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| STINSON LLP |
| 7700 FORSYTH BLVD., SUITE 1100 |
| ST. LOUIS, MO 63105 |
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05/28/2024 10:35 AM
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