Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/29/2023
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Application #:
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17320596
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Filing Dt:
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05/14/2021
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Publication #:
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Pub Dt:
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11/17/2022
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Inventors:
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Yu-Hao CHEN, Jui-Feng KUAN, Hui-Yu LEE, Chung-Ming WENG, Chien-Te WU
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Title:
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STRUCTURES AND PROCESS FLOW FOR INTEGRATED PHOTONIC-ELECTRIC IC PACKAGE BY USING POLYMER WAVEGUIDE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 8, LI-HSIN ROAD 6, HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
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| DUANE MORRIS LLP - SAN DIEGO |
| 750 B STREET, SUITE 2900 |
| SAN DIEGO, CA 92101 |
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