Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/29/2023
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Application #:
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17518201
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Filing Dt:
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11/03/2021
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Publication #:
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Pub Dt:
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10/20/2022
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Inventors:
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Jae Eun Kim, Tae Won Kim
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Title:
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BOBBIN STRUCTURE FOR PARTIONING COIL LAYERS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 12, HEOLLEUNG-RO, SEOCHO-GU |
| SEOUL, KOREA, REPUBLIC OF 06797 |
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| 12, HEOLLEUNG-RO, SEOCHO-GU |
| SEOUL, KOREA, REPUBLIC OF 06797 |
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| LEMPIA SUMMERFIELD KATZ LLC (HMC/KMC) |
| 20 SOUTH CLARK STREET |
| SUITE 600 |
| CHICAGO, IL 60603 |
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