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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
09/05/2023
Application #:
17957683
Filing Dt:
09/30/2022
Inventors:
Robin Davis, Paul R. Hoffman, Clifford Sandstrom, Timothy L. Olson
Title:
QUAD FLAT NO-LEAD (QFN) PACKAGE WITHOUT LEADFRAME AND DIRECT CONTACT INTERCONNECT BUILD-UP STRUCTURE AND METHOD FOR MAKING THE SAME
Assignment: 1
Reel/Frame:
061773/0054Recorded: 11/15/2022Pages: 7
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
11/02/2022
Exec Dt:
09/30/2022
Exec Dt:
10/03/2022
Exec Dt:
09/30/2022
Assignee:
1255 W. RIO SALADO PKWY., STE. 215
TEMPE, ARIZONA 85284
Correspondent:
CHANTAL OWENS
1255 W. RIO SALADO PKWY., STE. 215
TEMPE, AZ 85281

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