Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/05/2023
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Application #:
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17312046
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Filing Dt:
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06/09/2021
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Publication #:
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Pub Dt:
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01/27/2022
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Inventors:
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Hiroshi Hamada, Hideyuki Nosaka
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Title:
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High-Frequency Module
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5-1, OTEMACHI 1-CHOME, CHIYODA-KU |
| TOKYO, JAPAN 100-8116 |
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| SLATER MATSIL, LLP |
| 17950 PRESTON ROAD, SUITE 1000 |
| DALLAS, TX 75252 |
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05/06/2024 07:57 AM
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