Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/05/2023
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Application #:
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17537830
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Filing Dt:
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11/30/2021
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Publication #:
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Pub Dt:
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03/24/2022
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Inventors:
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Hsia-Wei Chen, Chih-Yang Chang, Chin-Chieh Yang, Jen-Sheng Yang, Sheng-Hung Shih et al
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Title:
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A FLAT BOTTOM ELECTRODE VIA (BEVA) TOP SURFACE FOR MEMORY
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 8, LI-HSIN RD. 6 |
| HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
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| ESCHWEILER & POTASHNIK, LLC |
| 629 EUCLID AVE. |
| SUITE 1101 |
| CLEVELAND, OH 44114 |
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