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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
11756980
Issue Dt:
09/12/2023
Application #:
16858674
Filing Dt:
04/26/2020
Publication #:
20200365649
Pub Dt:
11/19/2020
Inventors:
Jong Min JANG, Chang Yeon KIM, Myoung Hak YANG
Title:
LED CHIP PACKAGE AND MANUFACTURING METHOD OF THE SAME
Assignment: 1
Reel/Frame:
052496/0927Recorded: 04/26/2020Pages: 12
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
JANG, JONG MIN
Exec Dt:
04/13/2020
KIM, CHANG YEON
Exec Dt:
04/13/2020
YANG, MYOUNG HAK
Exec Dt:
04/13/2020
Assignee:
SEOUL VIOSYS CO., LTD.
65-16, SANDAN-RO 163 BEON-GIL, DANWON-GU
GYEONGGI-DO
YONGIN-SI, KOREA, REPUBLIC OF
Correspondent:
HAE-CHAN PARK
1894 PRESTON WHITE DRIVE
RESTON, VA 20191
Assignment: 2
Reel/Frame:
054887/0219Recorded: 01/03/2021Pages: 13
Conveyance:
CORRECTIVE ASSIGNMENT TO CORRECT THE APPLICATION NUMBER 16585674 PREVIOUSLY RECORDED AT REEL: 052496 FRAME: 0927. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
Assignors:
JANG, JONG MIN
Exec Dt:
04/13/2020
KIM, CHANG YEON
Exec Dt:
04/13/2020
YANG, MYOUNG HAK
Exec Dt:
04/13/2020
Assignee:
SEOUL VIOSYS CO., LTD.
65-15, SANDAN-RO 163 BEON-GIL, DANWON-GU
GYEONGGI-DO
ANSAN-SI, KOREA, REPUBLIC OF
Correspondent:
HAE-CHAN PARK
1894 PRESTON WHITE DRIVE
RESTON, VA 20191

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