Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/19/2023
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Application #:
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18097757
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Filing Dt:
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01/17/2023
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Publication #:
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Pub Dt:
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08/17/2023
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Inventors:
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Shengwang YU, Naixu WANG, Yong MA, Hongjun HEI, Yongsheng WANG, Changxing HAN, Bing ZHOU et al
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Title:
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METHOD FOR PREPARING HIGH-ENTROPY ALLOY COMPOSITES REINFORCED BY DIAMOND PARTICLES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 79, YINGZE WEST STREET, SHANXI |
| TAIYUAN, CHINA |
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| MAYER & WILLIAMS PC |
| 55 MADISON AVENUE |
| SUITE 400 |
| MORRISTOWN, NJ 07960 |
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