Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/03/2023
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Application #:
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17258266
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Filing Dt:
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01/06/2021
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Publication #:
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Pub Dt:
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09/02/2021
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Inventors:
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Elke Schmidt, Dietmar Birgel
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Title:
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METHOD FOR PRODUCING A HIGH-TEMPERATURE RESISTANT LEAD FREE SOLDER JOINT, AND HIGH-TEMPERATURE-RESISTANT LEAD-FREE SOLDER JOINT
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| HAUPTSTR.1 |
| MAULBURG, GERMANY 79689 |
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| ENDRESS+HAUSER, INC. |
| 2350 ENDRESS PLACE |
| PATSERVE |
| GREENWOOD, IN 46143 |
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