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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
11772228
Issue Dt:
10/03/2023
Application #:
16746292
Filing Dt:
01/17/2020
Publication #:
20210220964
Pub Dt:
07/22/2021
Inventors:
Ting-Hsun Chang, Hung Yen, Chi-Hsiang Shen, Fu-Ming Huang, Chun-Chieh Lin et al
Title:
Chemical Mechanical Polishing Apparatus Including a Multi-Zone Platen
Assignment: 1
Reel/Frame:
054130/0233Recorded: 10/21/2020Pages: 8
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
CHANG, TING-HSUN
Exec Dt:
04/21/2020
YEN, HUNG
Exec Dt:
04/21/2020
SHEN, CHI-HSIANG
Exec Dt:
04/21/2020
HUANG, FU-MING
Exec Dt:
04/21/2020
LIN, CHUN-CHIEH
Exec Dt:
04/21/2020
CUI, JI
Exec Dt:
04/21/2020
CHEN, LIANG-GUANG
Exec Dt:
05/05/2020
CHEN, CHIH HUNG
Exec Dt:
04/21/2020
CHEN, KEI-WEI
Exec Dt:
04/21/2020
CHANG, TSUNG HSIEN
Exec Dt:
10/13/2020
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6
HSINCHU SCIENCE PARK
HSINCHU, TAIWAN 300-78
Correspondent:
SLATER MATSIL, LLP/TSMC
17950 PRESTON ROAD, SUITE 1000
DALLAS, TX 75252

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