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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
11772339
Issue Dt:
10/03/2023
Application #:
17152926
Filing Dt:
01/20/2021
Publication #:
20210138747
Pub Dt:
05/13/2021
Inventors:
Sung-Hoon Ahn, Gil-Yong Lee, Jeong-Beom Ihn, Min-Soo Kim, Soo-Hong Min, Hyung-Soo Kim et al
Title:
Three-Dimensional Printing of Composite Repair Patches and Structures
Assignment: 1
Reel/Frame:
054963/0297Recorded: 01/20/2021Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
IHN, JEONG-BEOM
Exec Dt:
03/07/2018
Assignee:
THE BOEING COMPANY
100 NORTH RIVERSIDE PLAZA, MAIL CODE 2T-42
CHICAGO, ILLINOIS 60606-1596
Correspondent:
OSTRAGER CHONG FLAHERTY & BROITMAN, P.C.
437 MADISON AVENUE, 24TH FLOOR
NEW YORK, NY 10022-7035
Assignment: 2
Reel/Frame:
054963/0417Recorded: 01/20/2021Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
AHN, SUNG-HOON
Exec Dt:
02/28/2019
LEE, GIL-YONG
Exec Dt:
02/28/2019
KIM, HYUNG-SOO
Exec Dt:
02/28/2019
KIM, MIN-SOO
Exec Dt:
02/28/2019
KIM, HO-JIN
Exec Dt:
02/28/2019
MIN, SOO-HONG
Exec Dt:
02/28/2019
Assignee:
SEOUL NATIONAL UNIVERSITY R&DB FOUNDATION
SAN 56-1
SHINRIMODONG KWANAK-KU
SEOUL, KOREA, REPUBLIC OF 151-742
Correspondent:
OSTRAGER CHONG FLAHERTY & BROITMAN, P.C.
437 MADISON AVENUE, 24TH FLOOR
NEW YORK, NY 10022-7035

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