Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/03/2023
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Application #:
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16954576
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Filing Dt:
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06/17/2020
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Publication #:
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Pub Dt:
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10/22/2020
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Inventors:
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Takumi EBE, Katsushi MIKI
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Title:
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RESIN COMPOSITION, MOLDED ARTICLE AND HEAT-EXPANDABLE MICROSPHERES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-3 SHIBUKAWA-CHO 2-CHOME |
| YAO-SHI, OSAKA, JAPAN 5810075 |
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| SUGHRUE MION, PLLC |
| 2000 PENNSYLVANIA AVENUE, N.W. |
| SUITE 900 |
| WASHINGTON, DC 20006 |
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