Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/03/2023
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Application #:
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17505904
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Filing Dt:
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10/20/2021
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Publication #:
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Pub Dt:
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11/24/2022
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Inventors:
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MIAOBIN GAO, CHIA-CHI HU
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Title:
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SIGNAL TRANSMISSION CIRCUIT PACKAGING STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 13F.-1, NO. 716, ZHONGZHENG RD., ZHONGHE DIST. |
| NEW TAIPEI CITY, TAIWAN 23552 |
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| MUNCY, GEISSLER, OLDS & LOWE, PC |
| 4000 LEGATO RD., SUITE 310 |
| FAIRFAX, VA 22033 |
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