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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
10/03/2023
Application #:
17437598
Filing Dt:
09/09/2021
Publication #:
Pub Dt:
05/19/2022
Inventor:
Takuya NAKAMURA
Title:
THROUGH-HOLE VIA AND CIRCUIT BOARD
Assignment: 1
Reel/Frame:
057428/0971Recorded: 09/09/2021Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
08/10/2021
Assignee:
2-6-1, KITAMIKATA, TAKATSU-KU,
KAWASAKI-SHI,
KANAGAWA, JAPAN 213-8511
Correspondent:
NEC-IPC
2000 PENNSYLVANIA AVE., NW
SUITE 9000
WASHINGTON, DC 20006

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