Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/10/2023
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Application #:
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16956343
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Filing Dt:
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06/19/2020
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Publication #:
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Pub Dt:
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10/08/2020
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Inventor:
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Hiroshi Umetani
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Title:
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THERMALLY CONDUCTIVE COMPOSITION AND THERMALLY CONDUCTIVE MOLDED BODY
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 8-10-1, TAJIMA, SAKURA-KU, SAITAMA-CITY |
| SAITAMA, JAPAN 338-0837 |
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| TOMOKO NAKAJIMA |
| CERMAK NAKAJIMA & MCGOWAN LLP |
| 127 S. PEYTON ST., SUITE 200 |
| ALEXANDRIA, VA 22314 |
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