Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/10/2023
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Application #:
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17460379
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Filing Dt:
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08/30/2021
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Publication #:
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Pub Dt:
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12/15/2022
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Inventors:
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Jian Song, Jun Li, Xingshou Pang, Mingchuan Han, Jinzhong Yao, Xuesong Xu
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Title:
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INTEGRATED CIRCUIT PACKAGE AND METHOD TO MANUFACTURE THE INTEGRATED CIRCUIT PACKAGE TO REDUCE BOND WIRE DEFECTS IN THE INTEGRATED CIRCUIT PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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6501 WILLIAM CANNON DRIVE |
AUSTIN, TEXAS 78735 |
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NXP USA, INC. LAW DEPARTMENT |
6501 WILLIAM CANNON DRIVE WEST TX30/OE62 |
AUSTIN, 78735 UNITED STATES |
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