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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
10/17/2023
Application #:
16019923
Filing Dt:
06/27/2018
Publication #:
Pub Dt:
10/25/2018
Inventors:
Eiji ARIIZUMI, Mikio USHIJIMA, Naoto KIRIBE, Hajime MITSUISHI, Isao SUGAYA, Yoshiaki KITO et al
Title:
SUBSTRATE BONDING APPARATUS AND SUBSTRATE BONDING METHOD
Assignment: 1
Reel/Frame:
046342/0175Recorded: 07/13/2018Pages: 10
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/11/2018
Exec Dt:
06/11/2018
Exec Dt:
06/13/2018
Exec Dt:
06/11/2018
Exec Dt:
06/27/2018
Exec Dt:
06/25/2018
Exec Dt:
06/15/2018
Exec Dt:
06/11/2018
Assignee:
15-3, KONAN 2-CHOME, MINATO-KU
TOKYO, JAPAN 1086290
Correspondent:
FINNEGAN, HENDERSON, FARABOW, GARRETT &
901 NEW YORK AVENUE, NW
WASHINGTON, DC 20001-4413
Assignment: 2
Reel/Frame:
047375/0539Recorded: 09/05/2018Pages: 12
Conveyance:
CORRECTIVE ASSIGNMENT TO CORRECT THE OMITTED ASSIGNORS PREVIOUSLY RECORDED AT REEL: 046342 FRAME: 0175. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
Assignors:
Exec Dt:
06/11/2018
Exec Dt:
06/11/2018
Exec Dt:
06/13/2018
Exec Dt:
06/11/2018
Exec Dt:
06/27/2018
Exec Dt:
06/25/2018
Exec Dt:
06/15/2018
Exec Dt:
06/11/2018
Exec Dt:
06/12/2018
Exec Dt:
06/12/2018
Assignee:
15-3, KONAN 2-CHOME, MINATO-KU
TOKYO, JAPAN 1086290
Correspondent:
FINNEGAN, HENDERSON, FARABOW, GARRETT &
901 NEW YORK AVENUE, NW
WASHINGTON, DC 20001-4413

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