Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/17/2023
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Application #:
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17886704
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Filing Dt:
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08/12/2022
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Publication #:
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Pub Dt:
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12/08/2022
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Inventors:
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Yen-Yao Chi, Nai-Wei Liu, Ta-Jen Yu, Tzu-Hung Lin, Wen-Sung Hsu
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Title:
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CHIP SCALE PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 1, DUSING RD. 1ST |
| SCIENCE-BASED INDUSTRIAL PARK |
| HSIN-CHU 300, TAIWAN ROC |
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| MICHELE MORESCO |
| WOLF, GREENFIELD & SACKS, P.C. |
| 600 ATLANTIC AVENUE |
| BOSTON, MA 02210 |
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