Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/24/2023
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Application #:
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17377169
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Filing Dt:
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07/15/2021
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Publication #:
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Pub Dt:
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01/19/2023
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Inventors:
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Meng-Wei HSIEH, Hsiu-Chi LIU
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Title:
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SEMICONDUCTOR PACKAGE STRUCTURE INCLUDING REINFORCEMENT
COMPONENT AND METHOD FOR MANUFACTURING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 26 CHIN 3RD ROAD, NANZIH |
| KAOHSIUNG, TAIWAN 811 |
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| FOLEY & LARDNER LLP |
| 3000 K STREET, N.W. |
| SUITE 600 |
| WASHINGTON, DC 20007 |
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