Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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11/07/2023
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Application #:
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17588243
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Filing Dt:
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01/29/2022
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Publication #:
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Pub Dt:
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08/04/2022
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Inventors:
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Chunyan (Cherie) Zhou, Yuelin (Kevin) Liang, Daiqiong (Diana) Zhang et al
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Title:
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Electroplating Device and Electroplating System
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| UNIT 5 AND 6, LEVEL 2, BUILDING 20 |
| NO. 999 YINGLUN ROAD, CHINA (SHANGHAI) PILOT FREE TRADE ZONE |
| SHANGHAI, CHINA 201208 |
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| BARLEY SNYDER |
| 2 GREAT VALLEY PARKWAY |
| SUITE 110 |
| MALVERN, PA 19355 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 88, QIMING ROAD, AREA B |
| SUZHOU INDUSTRIAL ZONE EXPORTING AREA, JIANGSU PROV. |
| SUZHOU CITY, CHINA 215126 |
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| BARLEY SNYDER |
| 2 GREAT VALLEY PARKWAY |
| SUITE 110 |
| MALVERN, PA 19355 |
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