Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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11/07/2023
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Application #:
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17360571
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Filing Dt:
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06/28/2021
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Publication #:
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Pub Dt:
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12/30/2021
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Inventors:
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Janak PATEL, Richard GRAF, Manish NAYINI, Nazmul HABIB
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Title:
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Heat Sink Configuration for Multi-Chip Module
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5488 MARVELL LANE |
| SANTA CLARA, CALIFORNIA 95054 |
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| KELVIN VIVIAN |
| 5488 MARVELL LANE |
| SANTA CLARA, CA 95054 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| TAI SENG CENTRE |
| 3 IRVING ROAD #10-01 |
| SINGAPORE, SINGAPORE 369522 |
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| KELVIN VIVIAN |
| 5488 MARVELL LANE |
| SANTA CLARA, CA 95054 |
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05/15/2024 03:37 AM
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