Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/07/2023
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Application #:
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17082030
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Filing Dt:
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10/28/2020
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Publication #:
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Pub Dt:
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03/03/2022
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Inventors:
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Hsin-Chang Tsai, Ching-Wen Liu
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Title:
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INTELLIGENT POWER MODULE PACKAGING STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1F., NO.22, SEC. 2, NANKAN RD., LUZHU DIST., |
| TAOYUAN CITY, TAIWAN 338 |
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| JCIPRNET |
| 8F-1, NO. 100, ROOSEVELT RD. SEC. 2, |
| TAIPEI, 100404 TAIWAN |
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