Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/14/2023
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Application #:
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17604660
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Filing Dt:
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10/18/2021
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Publication #:
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Pub Dt:
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03/24/2022
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Inventors:
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Hiroyoshi KAWASAKI, Masato SHIRATORI, Yuji KAWAMATA
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Title:
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SOLDER ALLOY, SOLDER PASTE, SOLDER BALL, SOLDER PREFORM, SOLDER JOINT, AND SUBSTRATE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 23, SENJU-HASHIDO-CHO |
| ADACHI-KU, TOKYO, JAPAN 120-8555 |
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| NIXON PEABODY, LLP |
| 799 NINTH STREET, NW |
| SUITE 500 |
| WASHINGTON, DC 20001 |
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