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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
11813783
Issue Dt:
11/14/2023
Application #:
17023482
Filing Dt:
09/17/2020
Publication #:
20210086426
Pub Dt:
03/25/2021
Inventors:
Kakeru Sasagawa, Kei Yokota, Kenta Anegawa, Seiichiro Yamashita, Yuji Shinbaru et al
Title:
INJECTION MOLDING SYSTEM AND METHOD FOR MANUFACTURING MOLDED OBJECT
Assignment: 1
Reel/Frame:
053798/0992Recorded: 09/17/2020Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
SASAGAWA, KAKERU
Exec Dt:
06/23/2020
YOKOTA, KEI
Exec Dt:
07/06/2020
ANEGAWA, KENTA
Exec Dt:
06/24/2020
YAMASHITA, SEIICHIRO
Exec Dt:
06/30/2020
SHINBARU, YUJI
Exec Dt:
07/02/2020
MARUYAMA, KAZUNOBU
Exec Dt:
06/26/2020
MIYASHITA, DAICHI
Exec Dt:
06/25/2020
TAKANO, HIROKI
Exec Dt:
06/26/2020
HAYASHI, RIONA
Exec Dt:
06/25/2020
Assignee:
SEIKO EPSON CORPORATION
1-6, SHINJUKU 4-CHOME, SHINJUKU-KU
TOKYO, JAPAN 160-8801
Correspondent:
GLOBAL IP COUNSELORS, LLP DAVID TARNOFF
1233 20TH STREET, NW
SUITE 600
WASHINGTON, DC 20036-2680

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