Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/21/2023
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Application #:
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17614199
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Filing Dt:
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11/24/2021
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Publication #:
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Pub Dt:
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08/11/2022
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Inventors:
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Masato SHIRATORI, Hiroyoshi KAWASAKI, Yuji KAWAMATA
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Title:
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SOLDER ALLOY, SOLDER PASTE, SOLDER BALL, SOLDER PREFORM, SOLDER JOINT, ON-BOARD ELECTRONIC CIRCUIT, ECU ELECTRONIC CIRCUIT, ON-BOARD ELECTRONIC CIRCUIT DEVICE, AND ECU ELECTRONIC CIRCUIT DEVICE
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Assignment:
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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23,SENJU-HASHIDO-CHO, ADACHI-KU |
TOKYO, JAPAN 120-8555 |
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NIXON PEABODY LLP |
799 9TH STREET NW |
SUITE 500 |
WASHINGTON, DE 20001 |
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04/28/2024 04:31 PM
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