Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/21/2023
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Application #:
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17523698
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Filing Dt:
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11/10/2021
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Publication #:
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Pub Dt:
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01/12/2023
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Inventor:
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Hyun Chul SEO
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Title:
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SEMICONDUCTOR PACKAGES INCLUDING DIFFERENT TYPE SEMICONDUCTOR CHIPS HAVING EXPOSED TOP SURFACES AND METHODS OF MANUFACTURING THE SEMICONDUCTOR PACKAGES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2091, GYEONGCHUNG-DAERO, BUBAL-EUB |
| ICHEON-SI GYEONGGI-DO, KOREA, REPUBLIC OF 17336 |
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| WILLIAM PARK & ASSOCIATES LTD. |
| 930 N. YORK ROAD, SUITE 201 |
| HINSDALE, IL 60521 |
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