Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/21/2023
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Application #:
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17175490
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Filing Dt:
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02/12/2021
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Publication #:
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Pub Dt:
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08/19/2021
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Inventor:
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Roy Edward Meade
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Title:
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Chip-Last Wafer-Level Fan-Out with Optical Fiber Alignment Structure
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3351 OLCOTT STREET |
| SANTA CLARA, CALIFORNIA 95054 |
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| KENNETH D. WRIGHT |
| 5619 SCOTTS VALLEY DRIVE |
| SUITE 280 |
| SCOTTS VALLEY, CA 95066 |
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