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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
11/21/2023
Application #:
17397834
Filing Dt:
08/09/2021
Publication #:
Pub Dt:
02/09/2023
Inventors:
Sanjay Dabral, Jun Zhai, Vidhya Ramachandran, SivaChandra Jangam, Kunzhong Hu
Title:
Structure and Method for Sealing a Silicon IC
Assignment: 1
Reel/Frame:
057126/0459Recorded: 08/09/2021Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
08/06/2021
Exec Dt:
08/09/2021
Exec Dt:
08/06/2021
Exec Dt:
08/07/2021
Exec Dt:
08/09/2021
Assignee:
ONE APPLE PARK WAY
CUPERTINO, CALIFORNIA 95014
Correspondent:
AIKIN & GALLANT, LLP
445 S. SAN ANTONIO ROAD, SUITE 202
LOS ALTOS, CA 94022
Assignment: 2
Reel/Frame:
060592/0044Recorded: 07/06/2022Pages: 6
Conveyance:
CORRECTIVE ASSIGNMENT TO CORRECT THE THIRD INVENTOR'S FIRST NAME PREVIOUSLY RECORDED AT REEL: 057126 FRAME: 0459. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT .
Assignors:
Exec Dt:
08/06/2021
Exec Dt:
08/09/2021
Exec Dt:
08/07/2021
Exec Dt:
08/07/2021
Exec Dt:
08/09/2021
Assignee:
ONE APPLE PARK WAY
CUPERTINO, CALIFORNIA 95014
Correspondent:
AIKIN & GALLANT, LLP
445 S. SAN ANTONIO ROAD, SUITE 202
LOS ALTOS, CA 94022

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