Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/28/2023
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Application #:
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17924053
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Filing Dt:
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11/08/2022
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Publication #:
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Pub Dt:
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06/08/2023
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Inventors:
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Kiminori Washika, Tatsumi Kawafuchi
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Title:
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METHOD OF BONDING THERMOPLASTIC RESIN AND METAL
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2-1, ISHIUCHIMINAMI 5-CHOME, SAEKI-KU |
| HIROSHIMA-SHI, HIROSHIMA, JAPAN 731-5197 |
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| WHDA, LLP |
| 8500 LEESBURG PIKE |
| SUITE 7500 |
| TYSONS, VA 22182 |
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05/06/2024 03:22 PM
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