Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/28/2023
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Application #:
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17085215
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Filing Dt:
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10/30/2020
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Publication #:
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Pub Dt:
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02/17/2022
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Inventors:
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RAHUL AGARWAL, MICHAEL S. ALFANO, GABRIEL H. LOH, GABRIEL WONG, RAJA SWAMINATHAN et al
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Title:
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CREATING INTERCONNECTS BETWEEN DIES USING A CROSS-OVER DIE AND THROUGH-DIE VIAS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2485 AUGUSTINE DRIVE |
| SANTA CLARA, CALIFORNIA 95054 |
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| ONE COMMERCE VALLEY DRIVE EAST |
| MARKHAM, CANADA L3T 7X6 |
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| ADVANCED MICRO DEVICES INC., C/O KLS |
| 301 CONGRESS AVENUE |
| STE. 1350 |
| AUSTIN, TX 78701 |
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