Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/05/2023
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Application #:
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17460153
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Filing Dt:
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08/27/2021
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Publication #:
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Pub Dt:
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10/27/2022
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Inventors:
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Tung-Han CHUANG, Hsing-Hua TSAI
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Title:
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BONDING STRUCTURES AND METHODS FOR FORMING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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4F, NO. 9, LIXING 5TH RD., EAST DIST. |
HSINCHU CITY, TAIWAN 300 |
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NELSON QUINTERO |
615 HAMPTON DRIVE SUITE A202 |
VENICE, CA 90291 |
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05/28/2024 07:31 PM
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