Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/05/2023
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Application #:
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16474410
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Filing Dt:
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06/27/2019
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Publication #:
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Pub Dt:
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11/14/2019
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Inventor:
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Georg ZAISER
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Title:
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SEMICONDUCTOR MODULE COMPRISING A FIRST AND SECOND CONNECTING ELEMENT FOR CONNECTING A SEMICONDUCTOR CHIP, AND ALSO PRODUCTION METHOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| WERNER-VON-SIEMENS-STRASSE 1 |
| 80333 MÜNCHEN, GERMANY |
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| HENRY M FEIEREISEN LLC |
| 35 WEST 35TH STREET |
| SUITE 900 |
| NEW YORK, NY 10001 |
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