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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
11843153
Issue Dt:
12/12/2023
Application #:
16816968
Filing Dt:
03/12/2020
Publication #:
20200295427
Pub Dt:
09/17/2020
Inventors:
Martin W. BAYES, Gokce GULSOY, Ting GAO, David Bruce SARRAF, Chad William MORGAN et al
Title:
USE OF ENHANCED PERFORMANCE ULTRACONDUCTIVE COPPER MATERIALS IN CYLINDRICAL CONFIGURATIONS AND METHODS OF FORMING ULTRACONDUCTIVE COPPER MATERIALS
Assignment: 1
Reel/Frame:
052539/0547Recorded: 04/30/2020Pages: 12
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
BAYES, MARTIN W.
Exec Dt:
04/15/2020
GULSOY, GOKCE
Exec Dt:
04/15/2020
GAO, TING
Exec Dt:
04/29/2020
SARRAF, DAVID BRUCE
Exec Dt:
04/16/2020
MORGAN, CHAD WILLIAM
Exec Dt:
04/15/2020
MARTENS, RODNEY IVAN
Exec Dt:
04/15/2020
Assignee:
TE CONNECTIVITY SERVICES GMBH
MÜHLENSTRASSE 26
SCHAFFHAUSEN, SWITZERLAND 8200
Correspondent:
THE WHITAKER LLC
4550 LINDEN HILL ROAD
SUITE 140
WILMINGTON, DE 19808-2952
Assignment: 2
Reel/Frame:
060305/0923Recorded: 06/07/2022Pages: 21
Conveyance:
MERGER (SEE DOCUMENT FOR DETAILS).
Assignor:
TE CONNECTIVITY SERVICES GMBH
Exec Dt:
03/01/2022
Assignee:
TE CONNECTIVITY SOLUTIONS GMBH
MUEHLENSTRASSE 26
SCHAFFHAUSEN, SWITZERLAND 8200
Correspondent:
TE CONNECTIVITY CORPORATION C/O THE WHIT
4550 LINDEN HILL ROAD
SUITE 140
WILMINGTON, DE 19808

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