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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
12/19/2023
Application #:
17486807
Filing Dt:
09/27/2021
Publication #:
Pub Dt:
09/15/2022
Inventors:
Tingwen WEI, Yanyan WANG, Xiaoqiang CHEN, Jing WANG
Title:
METHOD FOR PHOTOCLEAVAGE OF AMIDE BONDS
Assignment: 1
Reel/Frame:
057632/0102Recorded: 09/28/2021Pages: 8
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
09/09/2021
Exec Dt:
09/09/2021
Exec Dt:
09/09/2021
Exec Dt:
09/09/2021
Assignee:
NO. 30, PUZHU SOUTH ROAD, JIANGBEI NEW DISTRICT
NANJING, CHINA 211816
Correspondent:
PERRY & CURRIER INC.
1300 YONGE STREET
SUITE 500
TORONTO, M4T 1X3 CANADA

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