Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/19/2023
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Application #:
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17132608
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Filing Dt:
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12/23/2020
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Publication #:
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Pub Dt:
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07/01/2021
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Inventors:
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Takayuki WASEDA, Takashi NAKAGAWA, Kimihiko NAKATANI, Motomu DEGAI, Takao IZAKI et al
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Title:
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METHODS OF PROCESSING SUBSTRATE AND MANUFACTURING SEMICONDUCTOR DEVICE BY FORMING FILM, SUBSTRATE PROCESSING APPARATUS, AND RECORDING MEDIUM
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3-4, KANDAKAJI-CHO, CHIYODA-KU |
| TOKYO, JAPAN 101-0045 |
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| VOLPE KOENIG |
| 30 SOUTH 17TH STREET-18TH FLOOR |
| PHILADELPHIA, PA 19103 |
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