Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/19/2023
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Application #:
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17839170
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Filing Dt:
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06/13/2022
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Publication #:
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Pub Dt:
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09/29/2022
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Inventors:
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Xin LIU, Rui CHENG, Robert Jan VISSER, Fei WANG, Abhijit Basu MALLICK
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Title:
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METHOD FOR SI GAP FILL BY PECVD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3050 BOWERS AVENUE |
| SANTA CLARA, CALIFORNIA 95054 |
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| PATTERSON + SHERIDAN, LLP |
| 24 GREENWAY PLAZA, SUITE 1600 |
| HOUSTON, TX 77046 |
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