Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/19/2023
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Application #:
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18116284
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Filing Dt:
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03/01/2023
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Inventors:
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Liang Zhu, Wendong Ma, Mao Wang, Chengzhou Liu, Sheng Liu, Jiafang Shan
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Title:
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IMPEDANCE MATCHING APPARATUS AND METHOD FOR SOLID-STATE MICROWAVE SOURCE
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Assignment:
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 350 SHUSHANHU ROAD, SHUSHAN DISTRICT |
| HEFEI, ANHUI, CHINA 230031 |
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| BYIP LTD. |
| 5465 LEGACY DRIVE, SUITE 650 |
| PLANO, TX 75024 |
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