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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
12/26/2023
Application #:
17249853
Filing Dt:
03/16/2021
Publication #:
Pub Dt:
09/30/2021
Inventors:
Rainer Markus SCHALLER, Jochen DANGELMAIER
Title:
MICROELECTROMECHANICAL SYSTEM (MEMS) SENSOR PACKAGES AND METHODS FOR PRODUCING MICROELECTROMECHANICAL SYSTEM SENSOR PACKAGES HAVING A PLURALITY OF MEMS SENSOR CHIPS
Assignment: 1
Reel/Frame:
055626/0291Recorded: 03/17/2021Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
02/08/2021
Exec Dt:
02/08/2021
Assignee:
AM CAMPEON 1-15
NEUBIBERG, GERMANY 85579
Correspondent:
HARRITY AND HARRITY, LLP
11350 RANDOM HILLS ROAD
SUITE 600
FAIRFAX, VA 22030

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