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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
11854784
Issue Dt:
12/26/2023
Application #:
17989498
Filing Dt:
11/17/2022
Publication #:
20230073399
Pub Dt:
03/09/2023
Inventors:
Yen-Yao Chi, Ta-Jen Yu, Shih-Chin Lin, Nai-Wei Liu, Tzu-Hung Lin, Wen-Sung Hsu
Title:
CHIP SCALE PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
Assignment: 1
Reel/Frame:
061816/0586Recorded: 11/17/2022Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
CHI, YEN-YAO
Exec Dt:
06/12/2020
LIU, NAI-WEI
Exec Dt:
06/12/2020
YU, TA-JEN
Exec Dt:
06/12/2020
LIN, TZU-HUNG
Exec Dt:
06/12/2020
HSU, WEN-SUNG
Exec Dt:
06/15/2020
LIN, SHIH-CHIN
Exec Dt:
06/12/2020
Assignee:
MEDIATEK INC.
NO. 1, DUSING 1ST RD.
HSINCHU SCIENCE PARK
HSINCHU CITY 30078, TAIWAN R.O.C.
Correspondent:
WOLF, GREENFIELD & SACKS, P.C.
600 ATLANTIC AVENUE
BOSTON, MA 02210-2206

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