Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/26/2023
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Application #:
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17700720
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Filing Dt:
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03/22/2022
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Publication #:
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Pub Dt:
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10/27/2022
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Inventors:
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Noriyasu YAMAMOTO, Yoshikazu MIHARA, Naoya SHIRAI
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Title:
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PACKAGE WITH HEAT DISSIPATING SUBSTRATE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2701-1, AZA IWAKURA, OMINECHO HIGASHIBUN, |
| MINE-SHI, YAMAGUCHI, JAPAN 759-2212 |
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| 2-56, SUDA-CHO, MIZUHO-KU |
| NAGOYA-SHI, AICHI, JAPAN 467-8530 |
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| MATTINGLY & MALUR, PC |
| 1800 DIAGONAL ROAD, SUITE 210 |
| ALEXANDRIA, VA 22314 |
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