Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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12/26/2023
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Application #:
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17007454
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Filing Dt:
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08/31/2020
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Publication #:
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Pub Dt:
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10/07/2021
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Inventors:
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Huan En Ku, Chee Kong Lee, Joo Shan Yam
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Title:
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SYSTEMS AND METHODS FOR PACKAGING AN ACOUSTIC DEVICE IN AN INTEGRATED CIRCUIT (IC)
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| ANZINGER STR. 13 |
| MÜNCHEN, GERMANY 81671 |
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| W&T/QUALCOMM |
| 106 PINEDALE SPRINGS WAY |
| CARY, NC 27511 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 80 ROBINSON ROAD |
| #02-00 |
| SINGAPORE, SINGAPORE 068898 |
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| QUALCOMM INCORPORATED |
| 5775 MOREHOUSE DRIVE |
| SAN DIEGO, CA 92121 |
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