Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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01/02/2024
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Application #:
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17345543
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Filing Dt:
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06/11/2021
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Publication #:
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Pub Dt:
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11/18/2021
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Inventors:
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Fujio MASUOKA, Yisuo LI, Nozomu HARADA
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Title:
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Method For Manufacturing Three-Dimensional Semiconductor Device
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-CHOME, 3-7, KOJIMACHI, |
| CHIYODA-KU, |
| TOKYO, JAPAN 102-0083 |
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| TADASHI HORIE |
| CROWELL & MORING LLP |
| PO BOX 10395 |
| CHICAGO, IL 60610 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 111 NORTH BRIDGE ROAD, #23-05, |
| PENINSULA PLAZA, |
| SINGAPORE, SINGAPORE 179098 |
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| TADASHI HORIE |
| CROWELL & MORING LLP |
| PO BOX 10395 |
| CHICAGO, IL 60610 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 111, NORTH BRIDGE ROAD, #23-05, |
| PENINSULA PLAZA,, SINGAPORE 179098 |
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| TADASHI HORIE |
| CROWELL & MORING LLP |
| PO BOX 10395 |
| CHICAG, IL 60610 |
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