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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
11862754
Issue Dt:
01/02/2024
Application #:
17740729
Filing Dt:
05/10/2022
Publication #:
20220271198
Pub Dt:
08/25/2022
Inventors:
Chen-Fu Chu, YI-FENG SHIH, SHIH-KAI CHAN, DAVID TRUNG DOAN, YOSHINORI OGAWA, KOHEl OTAKE et al
Title:
Method For Fabricating (LED) Dice Using Semiconductor Structures On A Substrate And Laser Lift-Off To A Receiving Plate
Assignment: 1
Reel/Frame:
060269/0711Recorded: 06/03/2022Pages: 16
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
CHU, CHEN-FU
Exec Dt:
05/26/2022
CHAN, SHIH-KAI
Exec Dt:
05/26/2022
SHIH, YI-FENG
Exec Dt:
05/26/2022
DOAN, DAVID TRUNG
Exec Dt:
05/26/2022
DOAN, TRUNG TRI
Exec Dt:
05/26/2022
OGAWA, YOSHINORI
Exec Dt:
05/26/2022
OTAKE, KOHEI
Exec Dt:
05/27/2022
KONDO, KAZUNORI
Exec Dt:
05/27/2022
OHORI, KEIJI
Exec Dt:
05/27/2022
KITAGAWA, TAICHI
Exec Dt:
05/27/2022
MATSUMOTO, NOBUAKI
Exec Dt:
05/29/2022
OZAI, TOSHIYUKI
Exec Dt:
05/27/2022
UEDA, SHUHEI
Exec Dt:
05/27/2022
Assignees:
SEMILEDS CORPORATION
1F, NO. 11, KE JUNG RD., CHU-NAN SITE
HSINCHU SCIENCE PARK
CHU-NAN, MIAO-LI COUNTY, TAIWAN 350
SHIN-ETSU CHEMICAL CO., LTD.
20TH FLOOR, MARUNOUCHI EIRAKU BLDG.,
4-1, MARUNOUCHI 1-CHOME, CHIYODA-KU
TOKYO, JAPAN 100-0005
Correspondent:
STEPHEN A. GRATTON
2764 SOUTH BRAUN WAY
LAKEWOOD, CO 80228

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