Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/02/2024
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Application #:
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17631256
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Filing Dt:
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01/28/2022
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Publication #:
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Pub Dt:
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09/01/2022
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Inventors:
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Jian Shi, Linfang Jin, Yongfu Sun, Jie Yang, Zhen Sun
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Title:
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Heat Conduction Apparatus and Terminal Device
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| HUAWEI ADMINISTRATION BUILDING |
| BANTIAN, LONGGANG DISTRICT |
| SHENZHEN, GUANGDONG, CHINA 518129 |
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| SLATER MATSIL, LLP |
| 17950 PRESTON ROAD |
| SUITE 1000 |
| DALLAS, TX 75252 |
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05/17/2024 11:38 AM
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