Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/09/2024
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Application #:
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17413403
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Filing Dt:
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06/11/2021
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Publication #:
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Pub Dt:
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02/10/2022
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Inventor:
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Ji-Hyung Lee
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Title:
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SEMICONDUCTOR PACKAGE COMPONENT
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| (CHEONAN THE FOURTH LOCAL INDUSTRIAL COMPLEX) |
| 19-1 BLOCK, 90, 4SANDAN 5-GIL, JIKSAN-EUP, SEOBUK-GU, CHEONAN-SI |
| CHUNGCHEONGNAM-DO, KOREA, REPUBLIC OF 31040 |
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| TRASKBRITT, P.C. |
| P.O. BOX 2550 |
| SALT LAKE CITY, UT 84110 |
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