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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
11876055
Issue Dt:
01/16/2024
Application #:
17507361
Filing Dt:
10/21/2021
Publication #:
20220130772
Pub Dt:
04/28/2022
Inventors:
Masao TSUJIMOTO, Masahiro HARAGUCHI, Yuuichi KANEKO, Takaaki KODAIRA, Kenichi FURUTA et al
Title:
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR WAFER
Assignment: 1
Reel/Frame:
058461/0761Recorded: 12/22/2021Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
FURUTA, KENICHI
Exec Dt:
10/19/2021
TSUJIMOTO, MASAO
Exec Dt:
10/19/2021
TERADA, NOBUHIRO
Exec Dt:
10/22/2021
HARAGUCHI, MASAHIRO
Exec Dt:
10/19/2021
INOUE, TSUYOSHI
Exec Dt:
10/19/2021
KANEKO, YUUICHI
Exec Dt:
10/19/2021
KUROKI, HIROKI
Exec Dt:
10/19/2021
KODAIRA, TAKAAKI
Exec Dt:
10/19/2021
Assignee:
LAPIS SEMICONDUCTOR CO., LTD.
2-4-8 SHINYOKOHAMA, KOUHOKU-KU
YOKOHAMA-SHI, KANAGAWA, JAPAN 222-8575
Correspondent:
RABIN & BERDO, P.C.
2650 PARK TOWER DRIVE, SUITE 800
VIENNA, VA 22180

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